Semiconductor mold cleaners MC-261 and MC-701 are thermosetting resins formed by mixing melamine resin with organic and inorganic fillers. Our mold cleaners yield good results in removing residuals left on the mold after molding with epoxy resin materials. Due to the molding conditions are the same as epoxy resin, they are easy to operate and can save time and effort.
Removing the residual in the mold after packaging and molding with epoxy molding compound.
Standard sized tablet mold cleaner.
Mini sized tablets, suitable for automated equipments.